AIM Solder 5202 SN100C is a lead-free solder alloy developed by Nihon Superior in Japan comprised of tin, copper, and a small amount of nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production for over six years. These advantages allow SN100C to offer high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy.

Benefits & Features of AIM Solder 5202 SN100C Lead-Free Solder:

• Does not contain silver or bismuth
• Eutectic alloy
• Bridge-free and icicle-free soldering
• Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate
• Good through-hole penetration
• Good topside fillet formation
• Dross rate equal or lower than tin-lead solder
• Does not require a nitrogen atmosphere
• Does not erode copper from holes, pads, and tracks
• Low rate of copper leaching makes it easy to control the copper content of the solder bath
• Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys
• Thermal fatigue resistance and creep strength better than tin-lead
• Slow, even growth of the intermetallic layer at the solder/substrate interface
• Performs well in selective and dip soldering