AIM Solder 21158 - NC257-2 Sn63/Pb37 No-Clean Type 3 Solder Paste - 500g Jar

AIM Solder 21158 - NC257-2 Sn63/Pb37 No-Clean Type 3 Solder Paste - 500g Jar
AIM Solder
SKU: NC257-2-A088
Manufacturer Part #: 21158
Manufacturer: AIM Solder
CALL 800-966-6020 TO ORDER

PLEASE NOTE: Because this item requires refrigeration when being shipped, the overnight shipping option MUST be selected.

The AIM Solder 21158 Sn63/Pb37 No-Clean Solder Paste has been developed to offer extremely broad process windows for printing, wetting, and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth, and shiny solder joints, and it has been specifically formulated to lower solder beading. It offers very low post-process residues, which remain crystal clear and easily probed. This solder paste has a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.

Benefits & Features of the AIM Solder 21158 NC257-2 Sn63/Pb37 No-Clean Type 3 Solder Paste:

  • Broad printing process window
  • Clear pin–probe testable residue
  • Reduces voiding under micro-BGAs
  • Low-tomb stoning
  • 24-hour stencil life
  • 12-14 hour tack time
  • No head-in-pillow affect
  • Excellent wetting
  • Low solder beading

Specifications of the AIM Solder 21158 NC257-2 Sn63/Pb37 No-Clean Type 3 Solder Paste:

  • Appearance: Gray, smooth, creamy
  • Alloy: Sn63/Pb37
  • Alloy composition: Tin - 63%, Lead - 37%
  • Melting point: 361.4°F (183°C)
  • Particle size: T3
  • General metal loading: 89.5% (T3)
  • Viscosity: Print/dispense
  • Shelf life: Refrigerated shelf life of 9 months at 40°F (4°C) to 55°F (12°C)/4 months at room temperature
  • Packaging: 500-gram jar
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