The Techspray 1821-10F No-Clean Desoldering Braid (wick) is pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder to be removed. Techspray No-Clean wick won't leave behind the ionic flux residues that can collect and form branches called "dendrites". Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads. Latent failures lead to costly returns and lower the quality perception of products. Techspray's no-clean braid is the cleanest in the industry and its proprietary flux formula is specially designed to avoid catastrophic and latent PCB failures caused by ionic flux residue.