The Chemtronics 40-3-10 Soder-Wick Lead-Free Braid SD w/SD Bobbin is specially designed for the removal of today’s high temperature lead-free solders and uses state of the art desoldering technology. It has a single-layer weave used for Soder-Wick Lead-Free braid is lighter in mass and responds faster than any other conventional desoldering braid. The unique design of the Chemtronics 40-3-10 Soder-Wick Lead-Free Braid SD w/SD Bobbin minimizes overheating and requires less contact time preventing heat damage to the PCB sensitive components. This desoldering braid can also be used with Tin/Lead solders and will not leave ionic contamination on the boards. The Chemtronics 40-3-10 is especially effective at removing residual solder from SMT pads and is RoHS compliant. It also meets MIL-F-14256 F, NASA-STD-8739.3 Soldered Electrical Connections, DOD-STD-883E method 2022, ANSI/IPC STD-004 Type ROL0.
Benefits & Features of the Chemtronics 40-3-10 Soder-Wick Lead-Free Braid SD w/SD Bobbin: