The MicroCare MCC-W66DF Stencil Wipes are MicroCare's most popular flat wipe for the benchtop, such as during rework and repair. These wipes feature a hydroentagled mesh of a durable, absorbant polymer. These new wipes are 10 times cleaner than classic stencil wipes and are stronger, lint less, absorb more paste and deliver more consistent cleaning. Most importantly, in some applications these fibers are strong enough to clean without solvents. This dramatically boosts yields while lowering costs.
Many benefits come from this new paper technology. Better cleaning avoids a source of solder paste contamination, with fewer defects and less rework than older types of stencil wipes. Better cleaning speeds the cleaning cycle, boosts throughput and reduces paper consumption. Ultra-strong, low-lint, high absorbency, this paper also is available in stencil rolls.