The Chemtronics SW14045 Soder-Wick Lead-Free Braid SD w/SD Bobbin is specially designed for the removal of today’s high temperature lead-free solders and uses state of the art desoldering technology. It has a single-layer weave used for Soder-Wick Lead-Free braid is lighter in mass and responds faster than any other conventional desoldering braid. The unique design of the Chemtronics SW14045 Soder-Wick Lead-Free Braid SD w/SD Bobbin minimizes overheating and requires less contact time preventing heat damage to the PCB sensitive components. This desoldering braid can also be used with Tin/Lead solders and will not leave ionic contamination on the boards. The Chemtronics SW14045 is especially effective at removing residual solder from SMT pads and is RoHS compliant. It also meets MIL-F-14256 F, NASA-STD-8739.3 Soldered Electrical Connections, DOD-STD-883E method 2022, ANSI/IPC STD-004 Type ROL0.
Benefits & Features of the Chemtronics SW14045 Soder-Wick Lead-Free Braid SD w/SD Bobbin: