The Chemtronics SW18055 Soder-Wick Desoldering Braid w/SD Bobbin is designed for today’s head sensitive electronic components using lighter mass, pure copper braid construction and offers state of the art technology. The construction of the desoldering braid allows for better thermal conductivity even at low temperatures and responds quicker than conventional desoldering braids. The Chemtronics SW18055 Soder-Wick Desoldering Braid w/SD Bobbin minimizes risk of damage associated with static electricity and heat damage to the board. It will not leave ionic contamination on the boards. This non-corrosive ultra-high purity Type R rosin flux meets MIL-F-14256 Type R flux, NASA-STD-8739.3 Soldered Electrical Connections, DOD-STD-883E method 2022, and ANSI/IPC J STD-004 Type ROL0.
Benefits & Features of the Chemtronics SW18055 Soder-Wick Desoldering Braid w/SD Bobbin: