The Aim 14275 Sn63Pb37 WS482 Water Soluble 3% Spool Solder is a water-soluble, halide-free, flux-cored wire that is highly active and compatible with water-soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standard or high-temperature alloys. WS482 offers residues that are non-corrosive and, therefore, may be used without cleaning for applications where conductivity will not cause a problem (such as soldering wires). Post-process residues are safe to remain on many assemblies for up to two to three days. WS482 produces excellent tarnish and oxide removal, it will not tarnish PCBs, copper, or solder joints, and offers excellent wetting and soldering characteristics.
AIM Sn63/Pb37 is a high clarity alloy that is composed of 63% tin and 37% lead. It goes through the Electropure™ process, which reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 361°F (183°C). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection, and as a base for soldering.