PLEASE NOTE: Because this item requires refrigeration when being shipped, the overnight shipping option MUST be selected.
The AIM Solder 21158 Sn63/Pb37 No-Clean Solder Paste has been developed to offer extremely broad process windows for printing, wetting, and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth, and shiny solder joints, and it has been specifically formulated to lower solder beading. It offers very low post-process residues, which remain crystal clear and easily probed. This solder paste has a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.